High-Performance Micro-LED Technology
High-Performance Micro-LED Technology
Dynamic Displays: Up to 28,000 Pixels Per Inch
Mojo’s micro-LED technology platform is designed around three key pillars:
Core Technology:
- Efficient blue micro-LED devices at sub-µm scale
- High efficiency quantum dot ink
Display System
- Optimized CMOS backplane
- Wafer to wafer bonding
- Custom micro-lens optics
High Volume Manufacturing
- 300mm GaN on Silicon
- End-to-end 300mm flow
High-definition R/G/B
- Three panel architecture produces ultra-high brightness with high efficiency for immersive AR headsets and AI smart glasses. By using a micro-lens with a matching diameter to the pixel pitch placed on top of a much smaller micro-LED emitter, Mojo is able to deliver up to 5 times more light flux of typical AR waveguides compared to conventional displays.
Monolithic RGB
- Single RGB panel provides an ultra-compact, high brightness image source and simple driving scheme for consumer AR glasses. High Performance Quantum Dots (HPQD) provide wide color gamut, stable colors, and high reliability.
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AI Infrastructure
Mojo’s micro-LED technology directly addresses significant data center concerns:
Power Consumption
- The efficiency of micro-LEDs allows Mojo’s AI infrastructure solution to keep power to <1 pJ/bit. This provides significant cost savings for continuously growing LLM and generative AI technologies.
I/O Density
- Tiny micro-LEDs that enable >100 Tbps/mm2 maximize access to memory, addressing the significant increase in input/output volume of LLMs and generative AI.
Integration, Cost, and Volume
- Micro-LEDs are integrated on 300mm wafers and can be added to any CMOS wafer. This gives customers the ability to integrate this technology with ease, while providing cost savings when compared to today’s conventional laser based optical interconnects.
Reliability
- Reliable materials, such as GaN which is regularly used at high-temperature junctions, and hybrid bonding to create a solution that customers can trust to consistently deliver.
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